• For automatic loading of high mix production line, one magazine capacity

• Maximum PCB size 508x406 mm
• Alignment repeatability ±0.0005 at 6σ
• Alignment accuracy ±0.0005 at 6σ

• Maximum PCB size 460x440 mm
• Optimal placement rate 11,600 cph (IPC 9850: 9,600)
• Component range 0201 to 45 x 45mm BGA, µBGA, Flip Chips, CSP,
• Connectors, Odds

• For checks and manual assembly work on the PCB without removing it from the PCB assembly line.

• Convection reflow oven equipped with the patented SMT slot nozzle systems, achieving very high efficiency of heat transfer
• This ensures processing of lead-free solder pastes at exact temperatures
• Peak zone temperature up to 350^oC, fan power, 1.600 m³/h each
• Sophisticated N2 control system available, control range for 20 to 1.500 ppm
• Soldering in a nitrogene atmosphere

Upstream and downstream communication is provided by SMEMA interface.